Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067831 | Integrated circuit package system with planar interconnects | Hyeog Chan Kwon, Jae Han Chung, Taeg Ki Lim, Jong Wook Ju | 2011-11-29 |
| 8017437 | Method for manufacturing a semiconductor package | Do Jae Yoo, Young Do Kweon, Seog Moon Choi, Bum Sik Jang | 2011-09-13 |
| 7875497 | Method of manufacturing a semiconductor package | Do Jae Yoo, Young Do Kweon, Seog Moon Choi, Bum Sik Jang | 2011-01-25 |
| 7875966 | Stacked integrated circuit and package system | Hyeog Chan Kwon, Youngcheol Kim | 2011-01-25 |
| 7875983 | Semiconductor package | Do Jae Yoo, Young Do Kweon, Seog Moon Choi, Bum Sik Jang | 2011-01-25 |