Issued Patents 2011
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8064215 | Semiconductor chip package and printed circuit board | Yul Kyo Chung, Sung Yi, Soon Gyu Yim, Seog Moon Choi, Jin Gu Kim | 2011-11-22 |
| 8026590 | Die package and method of manufacturing the same | Joon Seok Kang, Young-Ho Kim, Jin Gu Kim, Sung Yi | 2011-09-27 |
| 8017437 | Method for manufacturing a semiconductor package | Do Jae Yoo, Seog Moon Choi, Bum Sik Jang, Tae Sung Jeong | 2011-09-13 |
| 7947530 | Method of manufacturing wafer level package including coating and removing resin over the dicing lines | Jin Gu Kim, Hyung Jin Jeon, Seung Wook Park, Hee Kon Lee, Seon Hee Moon | 2011-05-24 |
| 7910385 | Method of fabricating microelectronic devices | J. Michael Brooks, Tongbi Jiang | 2011-03-22 |
| 7875497 | Method of manufacturing a semiconductor package | Do Jae Yoo, Seog Moon Choi, Bum Sik Jang, Tae Sung Jeong | 2011-01-25 |
| 7875983 | Semiconductor package | Do Jae Yoo, Seog Moon Choi, Bum Sik Jang, Tae Sung Jeong | 2011-01-25 |