Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8072055 | High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies | David J. Corisis, Shijian Luo | 2011-12-06 |
| 8022536 | Semiconductor substrate for build-up packages | — | 2011-09-20 |
| 7998860 | Method for fabricating semiconductor components using maskless back side alignment to conductive vias | Jin Li | 2011-08-16 |
| 7977157 | Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages | Setho Sing Fee, Lim Thiam Chye | 2011-07-12 |
| 7910385 | Method of fabricating microelectronic devices | Young Do Kweon, J. Michael Brooks | 2011-03-22 |
| 7888188 | Method of fabicating a microelectronic die having a curved surface | Zhong-Yi Xia, Sandhya Sandireddy | 2011-02-15 |