Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7977157 | Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages | Setho Sing Fee, Tongbi Jiang | 2011-07-12 |
LC
Lim Thiam Chye
Overall (2011): #234,466 of 364,097Top 65%
1
Patents 2011