Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8064215 | Semiconductor chip package and printed circuit board | Yul Kyo Chung, Soon Gyu Yim, Seog Moon Choi, Jin Gu Kim, Young Do Kweon | 2011-11-22 |
| 8026590 | Die package and method of manufacturing the same | Joon Seok Kang, Young-Ho Kim, Young Do Kweon, Jin Gu Kim | 2011-09-27 |
| 7992296 | PCB and manufacturing method thereof | Woon Chun Kim | 2011-08-09 |
| 7982982 | Wafer level packaging image sensor module having lens actuator and method of manufacturing the same | Seung Seoup Lee | 2011-07-19 |
| 7886414 | Method of manufacturing capacitor-embedded PCB | Woon Chun Kim, Hwa-Sun Park, Hong Won Kim, Dae Jun Kim, Jin Seon Park | 2011-02-15 |