Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8064215 | Semiconductor chip package and printed circuit board | Yul Kyo Chung, Sung Yi, Soon Gyu Yim, Seog Moon Choi, Young Do Kweon | 2011-11-22 |
| 8030203 | Method of forming metal line of semiconductor device | — | 2011-10-04 |
| 8026590 | Die package and method of manufacturing the same | Joon Seok Kang, Young-Ho Kim, Young Do Kweon, Sung Yi | 2011-09-27 |
| 7947530 | Method of manufacturing wafer level package including coating and removing resin over the dicing lines | Young Do Kweon, Hyung Jin Jeon, Seung Wook Park, Hee Kon Lee, Seon Hee Moon | 2011-05-24 |