Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7947530 | Method of manufacturing wafer level package including coating and removing resin over the dicing lines | Jin Gu Kim, Young Do Kweon, Hyung Jin Jeon, Seung Wook Park, Seon Hee Moon | 2011-05-24 |