Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7960806 | Sub-mount, light emitting diode package and manufacturing method thereof | Young Ki Lee, Seog Moon Choi, Sang Hyun Shin | 2011-06-14 |
| 7947530 | Method of manufacturing wafer level package including coating and removing resin over the dicing lines | Jin Gu Kim, Young Do Kweon, Seung Wook Park, Hee Kon Lee, Seon Hee Moon | 2011-05-24 |