Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030134 | Stacked semiconductor package having adhesive/spacer structure and insulation | Hyeog Chan Kwon | 2011-10-04 |
| 8030756 | Plastic ball grid array package with integral heatsink | TaeKeun Lee, Flynn Carson | 2011-10-04 |
| 7935572 | Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages | — | 2011-05-03 |
| 7923822 | Integrated circuit package system including shield | — | 2011-04-12 |