Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030756 | Plastic ball grid array package with integral heatsink | Flynn Carson, Marcos Karnezos | 2011-10-04 |
| 7875495 | Standoff height improvement for bumping technology using solder resist | TaeWoo Kang, YoRim Lee | 2011-01-25 |