Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8018052 | Integrated circuit package system with side substrate having a top layer | KyungOe Kim, HyunSu Shin | 2011-09-13 |
| 7951643 | Integrated circuit packaging system with lead frame and method of manufacture thereof | Jong-Woo Ha, DongSoo Moon | 2011-05-31 |
| 7875495 | Standoff height improvement for bumping technology using solder resist | YoRim Lee, TaeKeun Lee | 2011-01-25 |