Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7898072 | Package stacking system with mold contamination prevention | Youngjoon KIM | 2011-03-01 |
| 7875495 | Standoff height improvement for bumping technology using solder resist | TaeWoo Kang, TaeKeun Lee | 2011-01-25 |