Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8018052 | Integrated circuit package system with side substrate having a top layer | TaeWoo Kang, HyunSu Shin | 2011-09-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8018052 | Integrated circuit package system with side substrate having a top layer | TaeWoo Kang, HyunSu Shin | 2011-09-13 |