Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067268 | Stacked integrated circuit package system and method for manufacturing thereof | Jong-Woo Ha, BumJoon Hong, Seongmin Lee | 2011-11-29 |
| 8030756 | Plastic ball grid array package with integral heatsink | TaeKeun Lee, Marcos Karnezos | 2011-10-04 |