SL

Seongmin Lee

SC Stats Chippac: 2 patents #62 of 188Top 35%
📍 Seoul, IN: #4 of 6 inventorsTop 70%
Overall (2011): #68,326 of 364,097Top 20%
2
Patents 2011

Issued Patents 2011

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
8067268 Stacked integrated circuit package system and method for manufacturing thereof Flynn Carson, Jong-Woo Ha, BumJoon Hong 2011-11-29
8035237 Integrated circuit package system with heat slug Tae Keun Lee 2011-10-11