Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8035237 | Integrated circuit package system with heat slug | Seongmin Lee | 2011-10-11 |
| 8030755 | Integrated circuit package system with a heat sink | Sangkwon Lee | 2011-10-04 |
| 8022531 | Integrated circuit package system using heat slug | Kyungsic Yu, Youngnam Choi | 2011-09-20 |