Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067306 | Integrated circuit packaging system with exposed conductor and method of manufacture thereof | DeokKyung Yang | 2011-11-29 |
| 7884457 | Integrated circuit package system with dual side connection | Sungmin Song, JoHyun Bae | 2011-02-08 |
| 7863755 | Package-on-package system with via Z-interconnections | Taewoo Lee, Sang Ho Lee | 2011-01-04 |