Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7919871 | Integrated circuit package system for stackable devices | DongSoo Moon | 2011-04-05 |
| 7884457 | Integrated circuit package system with dual side connection | SeungYun Ahn, JoHyun Bae | 2011-02-08 |
| 7871861 | Stacked integrated circuit package system with intra-stack encapsulation | Junwoo Myung, Byoung Wook Jang | 2011-01-18 |