Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039275 | Integrated circuit packaging system with rounded interconnect and method of manufacture thereof | DaeSik Choi, SungWon Cho | 2011-10-18 |
| 7923304 | Integrated circuit packaging system with conductive pillars and method of manufacture thereof | DaeSik Choi, Junghoon Shin | 2011-04-12 |
| 7884457 | Integrated circuit package system with dual side connection | Sungmin Song, SeungYun Ahn | 2011-02-08 |