Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039275 | Integrated circuit packaging system with rounded interconnect and method of manufacture thereof | JoHyun Bae, DaeSik Choi | 2011-10-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039275 | Integrated circuit packaging system with rounded interconnect and method of manufacture thereof | JoHyun Bae, DaeSik Choi | 2011-10-18 |