Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030769 | Grooving bumped wafer pre-underfill system | Junghoon Shin, Sungyoon Lee | 2011-10-04 |
| 8017502 | Wafer system with partial cuts | Sang Ho Lee | 2011-09-13 |
| 7863755 | Package-on-package system with via Z-interconnections | Sang Ho Lee, SeungYun Ahn | 2011-01-04 |