Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030769 | Grooving bumped wafer pre-underfill system | Junghoon Shin, Taewoo Lee | 2011-10-04 |
| 7892072 | Method for directional grinding on backside of a semiconductor wafer | Junghoon Shin, BoHan Yoon | 2011-02-22 |