Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8012867 | Wafer level chip scale package system | Koo Hong Lee, Il Kwon Shim, Young Cheol Kim | 2011-09-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8012867 | Wafer level chip scale package system | Koo Hong Lee, Il Kwon Shim, Young Cheol Kim | 2011-09-06 |