Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026582 | Integrated circuit package system with internal stacking module adhesive | Jae-Chang Kim, Koo Hong Lee | 2011-09-27 |
| 7947535 | Thin package system with external terminals | Youngcheol Kim, Gwang Kim, Koo Hong Lee | 2011-05-24 |