Issued Patents 2011
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8062934 | Integrated circuit package system with ground bonds | Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2011-11-22 |
| 8039947 | Integrated circuit package system with different mold locking features | Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2011-10-18 |
| 8035204 | Large die package structures and fabrication method therefor | Jose Alvin Caparas, Jae Hun Ku | 2011-10-11 |
| 8022514 | Integrated circuit package system with leadfinger support | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Arnel Senosa Trasporto | 2011-09-20 |
| 8003443 | Non-leaded integrated circuit package system with multiple ground sites | Byung Tai Do, Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2011-08-23 |
| 7993939 | Integrated circuit package system with laminate base | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Arnel Senosa Trasporto | 2011-08-09 |
| 7977579 | Multiple flip-chip integrated circuit package system | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Arnel Senosa Trasporto | 2011-07-12 |
| 7947534 | Integrated circuit packaging system including a non-leaded package | Henry Descalzo Bathan, Il Kwon Shim, Keng Kiat Lau | 2011-05-24 |
| 7936053 | Integrated circuit package system with lead structures including a dummy tie bar | Henry Descalzo Bathan, Il Kwon Shim, Zigmund Ramirez Camacho | 2011-05-03 |
| 7928540 | Integrated circuit package system | Il Kwon Shim, Antonio B. Dimaano, Jr., Henry Descalzo Bathan | 2011-04-19 |
| 7915724 | Integrated circuit packaging system with base structure device | Jong-Woo Ha, Koo Hong Lee, Soo Won Lee, Juhyun Park, Zigmund Ramirez Camacho +2 more | 2011-03-29 |
| 7915716 | Integrated circuit package system with leadframe array | Jairus Legaspi Pisigan, Lionel Chien Hui Tay, Zigmund Ramirez Camacho | 2011-03-29 |
| 7901996 | Integrated circuit package system with interconnection support and method of manufacture thereof | Henry Descalzo Bathan, Il Kwon Shim, Zigmund Ramirez Camacho | 2011-03-08 |
| 7888181 | Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Henry Descalzo Bathan | 2011-02-15 |
| 7871863 | Integrated circuit package system with multiple molding | Zigmund Ramirez Camacho, Jose Alvin Caparas, Arnel Senosa Trasporto | 2011-01-18 |
| 7868471 | Integrated circuit package-in-package system with leads | Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Abelardo Hadap Advincula | 2011-01-11 |