Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067308 | Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support | Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Glenn Omandam, Hin Hwa Goh, Kock Liang Heng +1 more | 2011-11-29 |
| 8035204 | Large die package structures and fabrication method therefor | Jeffrey D. Punzalan, Jose Alvin Caparas | 2011-10-11 |