Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067308 | Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support | Pandi C. Marimuthu, Jae Hun Ku, Glenn Omandam, Hin Hwa Goh, Kock Liang Heng +1 more | 2011-11-29 |
| 8049328 | Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support | Pandi C. Marimuthu, Kock Liang Heng | 2011-11-01 |
| 8017515 | Semiconductor device and method of forming compliant polymer layer between UBM and conformal dielectric layer/RDL for stress relief | Pandi C. Marimuthu, Shuangwu Huang | 2011-09-13 |
| 7880293 | Wafer integrated with permanent carrier and method therefor | Byung Joon Han, Pandi C. Marimuthu, Kock Liang Heng | 2011-02-01 |
| 7863721 | Method and apparatus for wafer level integration using tapered vias | Pandi C. Marimuthu | 2011-01-04 |