Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067308 | Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support | Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Jae Hun Ku, Glenn Omandam, Kock Liang Heng +1 more | 2011-11-29 |
| 7880313 | Semiconductor flip chip package having substantially non-collapsible spacer | Jae Soo Lee, Geun Sik Kim, Sheila Marie L. Alvarez, Robinson Quiazon, Frederick R. Dahilig | 2011-02-01 |