Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084696 | Printed circuit board and manufacturing method thereof | Tae-Gui Kim, Young-Hwan Shin, Tae-Gon Lee | 2011-12-27 |
| 7880313 | Semiconductor flip chip package having substantially non-collapsible spacer | Geun Sik Kim, Sheila Marie L. Alvarez, Robinson Quiazon, Hin Hwa Goh, Frederick R. Dahilig | 2011-02-01 |