Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8022539 | Integrated circuit packaging system with increased connectivity and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2011-09-20 |
| 7880313 | Semiconductor flip chip package having substantially non-collapsible spacer | Jae Soo Lee, Geun Sik Kim, Sheila Marie L. Alvarez, Robinson Quiazon, Hin Hwa Goh | 2011-02-01 |