Issued Patents 2011
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8072047 | Integrated circuit package system with shield and tie bar | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Guruprasad Badakere Govindaiah | 2011-12-06 |
| 8072079 | Through hole vias at saw streets including protrusions or recesses for interconnection | Reza A. Pagaila, Zigmund Ramirez Camacho, Byung Tai Do | 2011-12-06 |
| 8043894 | Integrated circuit package system with redistribution layer | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2011-10-25 |
| 8039302 | Semiconductor package and method of forming similar structure for top and bottom bonding pads | Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2011-10-18 |
| 8035207 | Stackable integrated circuit package system with recess | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jose Alvin Caparas | 2011-10-11 |
| 8022539 | Integrated circuit packaging system with increased connectivity and method of manufacture thereof | Frederick R. Dahilig, Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2011-09-20 |
| 7998790 | Integrated circuit packaging system with isolated pads and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jose Alvin Caparas | 2011-08-16 |
| 7977779 | Mountable integrated circuit package-in-package system | Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Henry Descalzo Bathan | 2011-07-12 |
| 7977782 | Integrated circuit package system with dual connectivity | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Jose Alvin Caparas | 2011-07-12 |
| 7977780 | Multi-layer package-on-package system | Jairus Legaspi Pisigan, Zigmund Ramirez Camacho | 2011-07-12 |
| 7977778 | Integrated circuit package system with interference-fit feature | Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2011-07-12 |
| 7964450 | Wirebondless wafer level package with plated bumps and interconnects | Zigmund Ramirez Camacho, Dioscoro A. Merilo, Jose Alvin Caparas | 2011-06-21 |
| 7960815 | Leadframe design for QFN package with top terminal leads | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jose Alvin Caparas | 2011-06-14 |
| 7932130 | Method for forming an etched recess package on package system | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jairus Legaspi Pisigan | 2011-04-26 |
| 7919850 | Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereof | Arnel Senosa Trasporto, Zigmund Ramirez Camacho, Abelardo Hadap Advincula | 2011-04-05 |
| 7919848 | Integrated circuit package system with multiple devices | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Abelardo Jr Hadap Advincula | 2011-04-05 |
| 7915716 | Integrated circuit package system with leadframe array | Jairus Legaspi Pisigan, Jeffrey D. Punzalan, Zigmund Ramirez Camacho | 2011-03-29 |
| 7915724 | Integrated circuit packaging system with base structure device | Jong-Woo Ha, Koo Hong Lee, Soo Won Lee, Juhyun Park, Zigmund Ramirez Camacho +2 more | 2011-03-29 |
| 7911067 | Semiconductor package system with die support pad | Zigmund Ramirez Camacho, Dioscoro A. Merilo | 2011-03-22 |
| 7911040 | Integrated circuit package with improved connections | Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2011-03-22 |
| 7888181 | Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2011-02-15 |
| 7871862 | Ball grid array package stacking system | Seng Guan Chow | 2011-01-18 |
| 7863732 | Ball grid array package system | Seng Guan Chow | 2011-01-04 |
| 7863102 | Integrated circuit package system with external interconnects within a die platform | Seng Guan Chow | 2011-01-04 |