Issued Patents 2011
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080882 | Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the device | Byung Tai Do, Heap Hoe Kuan, Linda Pei Ee Chua | 2011-12-20 |
| 8080445 | Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposers | — | 2011-12-20 |
| 8076757 | Semiconductor device having electrical devices mounted to IPD structure and method of shielding electromagnetic interference | Byung Tai Do, Yaojian Lin, Rui Huang | 2011-12-13 |
| 8072079 | Through hole vias at saw streets including protrusions or recesses for interconnection | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Byung Tai Do | 2011-12-06 |
| 8063477 | Integrated circuit packaging system having asymmetric encapsulation structures and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2011-11-22 |
| 8039304 | Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structures | — | 2011-10-18 |
| 8039384 | Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces | KiYoun Jang, HunTeak Lee | 2011-10-18 |
| 8030136 | Semiconductor device and method of conforming conductive vias between insulating layers in saw streets | Linda Pei Ee Chua, Byung Tai Do | 2011-10-04 |
| 8021907 | Method and apparatus for thermally enhanced semiconductor package | Byung Tai Do, Zigmund Ramirez Camacho | 2011-09-20 |
| 8021930 | Semiconductor device and method of forming dam material around periphery of die to reduce warpage | — | 2011-09-20 |
| 8003445 | Integrated circuit packaging system with z-interconnects having traces and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2011-08-23 |
| 7994624 | Integrated circuit package system with adhesive segment spacer | Linda Pei Ee Chua, Byung Tai Do | 2011-08-09 |
| 7993976 | Semiconductor device and method of forming conductive vias with trench in saw street | Byung Tai Do | 2011-08-09 |
| 7977802 | Integrated circuit packaging system with stacked die and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2011-07-12 |
| 7968979 | Integrated circuit package system with conformal shielding and method of manufacture thereof | Linda Pei Ee Chua, Byung Tai Do | 2011-06-28 |
| 7955942 | Semiconductor device and method of forming a 3D inductor from prefabricated pillar frame | Yaojian Lin | 2011-06-07 |
| 7952176 | Integrated circuit packaging system and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2011-05-31 |
| 7927917 | Integrated circuit packaging system with inward and outward interconnects and method of manufacture thereof | Byung Tai Do, Jong-Woo Ha | 2011-04-19 |
| 7911070 | Integrated circuit packaging system having planar interconnect | Byung Tai Do, Heap Hoe Kuan | 2011-03-22 |
| 7880275 | Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device | Byung Tai Do, Rui Huang | 2011-02-01 |