Issued Patents 2011
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084849 | Integrated circuit package system with offset stacking | Seng Guan Chow, Heap Hoe Kuan | 2011-12-27 |
| 8084302 | Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan, Rui Huang | 2011-12-27 |
| 8080882 | Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the device | Byung Tai Do, Heap Hoe Kuan, Reza A. Pagaila | 2011-12-20 |
| 8063477 | Integrated circuit packaging system having asymmetric encapsulation structures and method of manufacture thereof | Reza A. Pagaila, Byung Tai Do | 2011-11-22 |
| 8049314 | Integrated circuit package system with insulator over circuitry | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan, Rui Huang | 2011-11-01 |
| 8030136 | Semiconductor device and method of conforming conductive vias between insulating layers in saw streets | Reza A. Pagaila, Byung Tai Do | 2011-10-04 |
| 8026127 | Integrated circuit package system with slotted die paddle and method of manufacture thereof | Byung Tai Do | 2011-09-27 |
| 8021923 | Semiconductor package having through-hole vias on saw streets formed with partial saw | Byung Tai Do, Heap Hoe Kuan | 2011-09-20 |
| 8017521 | Semiconductor package having through-hole vias on saw streets formed with partial saw | Byung Tai Do, Heap Hoe Kuan | 2011-09-13 |
| 8017501 | Semiconductor package having through-hole vias on saw streets formed with partial saw | Byung Tai Do, Heap Hoe Kuan | 2011-09-13 |
| 8003445 | Integrated circuit packaging system with z-interconnects having traces and method of manufacture thereof | Reza A. Pagaila, Byung Tai Do | 2011-08-23 |
| 7993979 | Leadless package system having external contacts | Byung Tai Do, Heap Hoe Kuan | 2011-08-09 |
| 7994624 | Integrated circuit package system with adhesive segment spacer | Byung Tai Do, Reza A. Pagaila | 2011-08-09 |
| 7989269 | Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan, Rui Huang | 2011-08-02 |
| 7985628 | Integrated circuit package system with interconnect lock | Heap Hoe Kuan, Seng Guan Chow, Dioscoro A. Merilo | 2011-07-26 |
| 7977802 | Integrated circuit packaging system with stacked die and method of manufacture thereof | Reza A. Pagaila, Byung Tai Do | 2011-07-12 |
| 7968979 | Integrated circuit package system with conformal shielding and method of manufacture thereof | Reza A. Pagaila, Byung Tai Do | 2011-06-28 |
| 7952176 | Integrated circuit packaging system and method of manufacture thereof | Reza A. Pagaila, Byung Tai Do | 2011-05-31 |
| 7948066 | Integrated circuit package system with lead locking structure | Byung Tai Do, Heap Hoe Kuan | 2011-05-24 |
| 7923846 | Integrated circuit package-in-package system with wire-in-film encapsulant | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan, Rui Huang | 2011-04-12 |
| 7902638 | Semiconductor die with through-hole via on saw streets and through-hole via in active area of die | Byung Tai Do, Heap Hoe Kuan | 2011-03-08 |
| 7872345 | Integrated circuit package system with rigid locking lead | Seng Guan Chow, Heap Hoe Kuan | 2011-01-18 |