Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076184 | Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die | Zigmund Ramirez Camacho, Emmanuel Espiritu, Henry Descalzo Bathan | 2011-12-13 |
| 8067832 | Embedded integrated circuit package system and method of manufacture thereof | You Yang Ong, Seng Guan Chow | 2011-11-29 |
| 7985628 | Integrated circuit package system with interconnect lock | Heap Hoe Kuan, Seng Guan Chow, Linda Pei Ee Chua | 2011-07-26 |
| 7986043 | Integrated circuit package on package system | Seng Guan Chow, Antonio B. Dimaano, Jr., Heap Hoe Kuan, Tsz Yin Ho | 2011-07-26 |
| 7981702 | Integrated circuit package in package system | Tsz Yin Ho, Seng Guan Chow, Antonio B. Dimaano, Jr., Heap Hoe Kuan | 2011-07-19 |
| 7964450 | Wirebondless wafer level package with plated bumps and interconnects | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jose Alvin Caparas | 2011-06-21 |
| 7911067 | Semiconductor package system with die support pad | Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2011-03-22 |
| 7868434 | Integrated circuit package-on-package stacking system | Heap Hoe Kuan, You Yang Ong, Seng Guan Chow, Ma. Shirley Asoy | 2011-01-11 |