Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076184 | Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Dioscoro A. Merilo | 2011-12-13 |
| 8026129 | Stacked integrated circuits package system with passive components | Philip Lyndon Cablao, Dario S. Filoteo, Jr., Leo A. Merilo, Rachel Layda Abinan, Allan P. Ilagan | 2011-09-27 |
| 8021931 | Direct via wire bonding and method of assembling the same | Dario S. Filoteo, Jr. | 2011-09-20 |