Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030783 | Integrated circuit package with open substrate | Il Kwon Shim, Kwee Lan Tan, Jian Li | 2011-10-04 |
| 8026129 | Stacked integrated circuits package system with passive components | Philip Lyndon Cablao, Leo A. Merilo, Emmanuel Espiritu, Rachel Layda Abinan, Allan P. Ilagan | 2011-09-27 |
| 8021931 | Direct via wire bonding and method of assembling the same | Emmanuel Espiritu | 2011-09-20 |
| 7928564 | Multichip module package and fabrication method | Il Kwon Shim, Tsz Yin Ho, Sebastian T. M. Soon | 2011-04-19 |
| 7911046 | Integrated circuit packaging system with interposer | Philip Lyndon Cablao, Rachel Layda Abinan, Allan P. Ilagan | 2011-03-22 |
| 7863730 | Array-molded package heat spreader and fabrication method therefor | Il Kwon Shim, Kambhampati Ramakrishna, Diane Sahakian, Seng Guan Chow, Virgil Ararao | 2011-01-04 |