Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7863730 | Array-molded package heat spreader and fabrication method therefor | Il Kwon Shim, Kambhampati Ramakrishna, Seng Guan Chow, Dario S. Filoteo, Jr., Virgil Ararao | 2011-01-04 |