Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7986043 | Integrated circuit package on package system | Dioscoro A. Merilo, Seng Guan Chow, Antonio B. Dimaano, Jr., Heap Hoe Kuan | 2011-07-26 |
| 7981702 | Integrated circuit package in package system | Dioscoro A. Merilo, Seng Guan Chow, Antonio B. Dimaano, Jr., Heap Hoe Kuan | 2011-07-19 |
| 7928564 | Multichip module package and fabrication method | Il Kwon Shim, Dario S. Filoteo, Jr., Sebastian T. M. Soon | 2011-04-19 |