Issued Patents 2011
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080867 | Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan | 2011-12-20 |
| 8076184 | Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die | Zigmund Ramirez Camacho, Emmanuel Espiritu, Dioscoro A. Merilo | 2011-12-13 |
| 8072047 | Integrated circuit package system with shield and tie bar | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Guruprasad Badakere Govindaiah | 2011-12-06 |
| 8067825 | Integrated circuit package system with multiple die | Abelardo Jr. Hadap Advincula, Zigmund Ramirez Camacho, Jairus Legaspi Pisigan | 2011-11-29 |
| 8062934 | Integrated circuit package system with ground bonds | Jeffrey D. Punzalan, Zigmund Ramirez Camacho | 2011-11-22 |
| 8043894 | Integrated circuit package system with redistribution layer | Lionel Chien Hui Tay, Zigmund Ramirez Camacho | 2011-10-25 |
| 8039302 | Semiconductor package and method of forming similar structure for top and bottom bonding pads | Lionel Chien Hui Tay, Zigmund Ramirez Camacho | 2011-10-18 |
| 8039947 | Integrated circuit package system with different mold locking features | Jeffrey D. Punzalan, Zigmund Ramirez Camacho | 2011-10-18 |
| 8035207 | Stackable integrated circuit package system with recess | Zigmund Ramirez Camacho, Jose Alvin Caparas, Lionel Chien Hui Tay | 2011-10-11 |
| 8022514 | Integrated circuit package system with leadfinger support | Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2011-09-20 |
| 8022539 | Integrated circuit packaging system with increased connectivity and method of manufacture thereof | Frederick R. Dahilig, Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2011-09-20 |
| 8003443 | Non-leaded integrated circuit package system with multiple ground sites | Jeffrey D. Punzalan, Byung Tai Do, Zigmund Ramirez Camacho | 2011-08-23 |
| 7998790 | Integrated circuit packaging system with isolated pads and method of manufacture thereof | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jose Alvin Caparas | 2011-08-16 |
| 7993939 | Integrated circuit package system with laminate base | Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2011-08-09 |
| 7977779 | Mountable integrated circuit package-in-package system | Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Lionel Chien Hui Tay | 2011-07-12 |
| 7977778 | Integrated circuit package system with interference-fit feature | Lionel Chien Hui Tay, Zigmund Ramirez Camacho | 2011-07-12 |
| 7977579 | Multiple flip-chip integrated circuit package system | Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2011-07-12 |
| 7960815 | Leadframe design for QFN package with top terminal leads | Zigmund Ramirez Camacho, Jose Alvin Caparas, Lionel Chien Hui Tay | 2011-06-14 |
| 7947534 | Integrated circuit packaging system including a non-leaded package | Jeffrey D. Punzalan, Il Kwon Shim, Keng Kiat Lau | 2011-05-24 |
| 7936053 | Integrated circuit package system with lead structures including a dummy tie bar | Jeffrey D. Punzalan, Il Kwon Shim, Zigmund Ramirez Camacho | 2011-05-03 |
| 7932130 | Method for forming an etched recess package on package system | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jairus Legaspi Pisigan | 2011-04-26 |
| 7928540 | Integrated circuit package system | Il Kwon Shim, Antonio B. Dimaano, Jr., Jeffrey D. Punzalan | 2011-04-19 |
| 7919848 | Integrated circuit package system with multiple devices | Zigmund Ramirez Camacho, Abelardo Jr Hadap Advincula, Lionel Chien Hui Tay | 2011-04-05 |
| 7911040 | Integrated circuit package with improved connections | Lionel Chien Hui Tay, Zigmund Ramirez Camacho | 2011-03-22 |
| 7901996 | Integrated circuit package system with interconnection support and method of manufacture thereof | Il Kwon Shim, Jeffrey D. Punzalan, Zigmund Ramirez Camacho | 2011-03-08 |