Issued Patents 2011
Showing 26–26 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7888181 | Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jeffrey D. Punzalan | 2011-02-15 |