Issued Patents 2011
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067308 | Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support | Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Jae Hun Ku, Glenn Omandam, Hin Hwa Goh +1 more | 2011-11-29 |
| 8035207 | Stackable integrated circuit package system with recess | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2011-10-11 |
| 8035204 | Large die package structures and fabrication method therefor | Jeffrey D. Punzalan, Jae Hun Ku | 2011-10-11 |
| 7998790 | Integrated circuit packaging system with isolated pads and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2011-08-16 |
| 7977782 | Integrated circuit package system with dual connectivity | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Lionel Chien Hui Tay | 2011-07-12 |
| 7964450 | Wirebondless wafer level package with plated bumps and interconnects | Zigmund Ramirez Camacho, Dioscoro A. Merilo, Lionel Chien Hui Tay | 2011-06-21 |
| 7960815 | Leadframe design for QFN package with top terminal leads | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2011-06-14 |
| 7919360 | Integrated circuit packaging system with circuitry stacking and method of manufacture thereof | Zigmund Ramirez Camacho, Arnel Senosa Trasporto | 2011-04-05 |
| 7871863 | Integrated circuit package system with multiple molding | Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2011-01-18 |