Issued Patents 2011
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8022514 | Integrated circuit package system with leadfinger support | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Jeffrey D. Punzalan | 2011-09-20 |
| 7993939 | Integrated circuit package system with laminate base | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2011-08-09 |
| 7989931 | Integrated circuit package system with under paddle leadfingers | Guruprasad Badakere Govindaiah | 2011-08-02 |
| 7977579 | Multiple flip-chip integrated circuit package system | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Jeffrey D. Punzalan | 2011-07-12 |
| 7977779 | Mountable integrated circuit package-in-package system | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Henry Descalzo Bathan | 2011-07-12 |
| 7919850 | Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereof | Lionel Chien Hui Tay, Zigmund Ramirez Camacho, Abelardo Hadap Advincula | 2011-04-05 |
| 7919360 | Integrated circuit packaging system with circuitry stacking and method of manufacture thereof | Zigmund Ramirez Camacho, Jose Alvin Caparas | 2011-04-05 |
| 7871863 | Integrated circuit package system with multiple molding | Zigmund Ramirez Camacho, Jose Alvin Caparas, Jeffrey D. Punzalan | 2011-01-18 |
| 7868471 | Integrated circuit package-in-package system with leads | Zigmund Ramirez Camacho, Jeffrey D. Punzalan, Abelardo Hadap Advincula | 2011-01-11 |