Issued Patents 2011
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080867 | Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2011-12-20 |
| 8067825 | Integrated circuit package system with multiple die | Abelardo Jr. Hadap Advincula, Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2011-11-29 |
| 7977780 | Multi-layer package-on-package system | Lionel Chien Hui Tay, Zigmund Ramirez Camacho | 2011-07-12 |
| 7977782 | Integrated circuit package system with dual connectivity | Zigmund Ramirez Camacho, Jose Alvin Caparas, Lionel Chien Hui Tay | 2011-07-12 |
| 7932130 | Method for forming an etched recess package on package system | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2011-04-26 |
| 7915724 | Integrated circuit packaging system with base structure device | Jong-Woo Ha, Koo Hong Lee, Soo Won Lee, Juhyun Park, Zigmund Ramirez Camacho +2 more | 2011-03-29 |
| 7915716 | Integrated circuit package system with leadframe array | Jeffrey D. Punzalan, Lionel Chien Hui Tay, Zigmund Ramirez Camacho | 2011-03-29 |