Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067832 | Embedded integrated circuit package system and method of manufacture thereof | Dioscoro A. Merilo, Seng Guan Chow | 2011-11-29 |
| 7868434 | Integrated circuit package-on-package stacking system | Dioscoro A. Merilo, Heap Hoe Kuan, Seng Guan Chow, Ma. Shirley Asoy | 2011-01-11 |