Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7868434 | Integrated circuit package-on-package stacking system | Dioscoro A. Merilo, Heap Hoe Kuan, You Yang Ong, Seng Guan Chow | 2011-01-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7868434 | Integrated circuit package-on-package stacking system | Dioscoro A. Merilo, Heap Hoe Kuan, You Yang Ong, Seng Guan Chow | 2011-01-11 |