SH

Shuangwu Huang

SC Stats Chippac: 1 patents #96 of 188Top 55%
📍 Singapore, SG: #215 of 890 inventorsTop 25%
Overall (2011): #168,117 of 364,097Top 50%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8017515 Semiconductor device and method of forming compliant polymer layer between UBM and conformal dielectric layer/RDL for stress relief Pandi C. Marimuthu, Nathapong Suthiwongsunthorn 2011-09-13