Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7986032 | Semiconductor package system with substrate having different bondable heights at lead finger tips | Seng Guan Chow, Ming Ying, II Kwon Shim | 2011-07-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7986032 | Semiconductor package system with substrate having different bondable heights at lead finger tips | Seng Guan Chow, Ming Ying, II Kwon Shim | 2011-07-26 |