Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7986032 | Semiconductor package system with substrate having different bondable heights at lead finger tips | Seng Guan Chow, II Kwon Shim, Lip Seng Tan | 2011-07-26 |
| 7968377 | Integrated circuit protruding pad package system | Seng Guan Chow, Il Kwon Shim, Roger Emigh | 2011-06-28 |
| 7960816 | Semiconductor package with passive device integration | Seng Guan Chow, Il Kwon Shim, Byung Hoon Ahn | 2011-06-14 |