Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067271 | Integrated circuit package system with encapsulation lock | Byung Tai Do | 2011-11-29 |
| 7919838 | Integrated circuit package system with encapsulation lock and method of manufacture thereof | Byung Tai Do | 2011-04-05 |