Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7952211 | Semiconductor assembly with component pads attached on die back side | Seng Guan Chow | 2011-05-31 |
| 7901956 | Structure for bumped wafer test | Byung Tai Do, Lee Huang Chew | 2011-03-08 |